Keyword search (4,164 papers available)

"Hamed H" Authored Publications:

Title Authors PubMed ID
1 Electroforming of Personalized Multi-Level and Free-Form Metal Parts Utilizing Fused Deposition Modeling-Manufactured Molds Hamed H; Aghili S; Wüthrich R; Abou-Ziki JD; 38930706
ENCS

 

Title:Electroforming of Personalized Multi-Level and Free-Form Metal Parts Utilizing Fused Deposition Modeling-Manufactured Molds
Authors:Hamed HAghili SWüthrich RAbou-Ziki JD
Link:https://pubmed.ncbi.nlm.nih.gov/38930706/
DOI:10.3390/mi15060734
Publication:Micromachines
Keywords:electroformingfused deposition modeling (FDM)metal additive manufacturingmoldpersonalization
PMID:38930706 Category: Date Added:2024-06-27
Dept Affiliation: ENCS
1 Department of Mechanical and Manufacturing Engineering, University of Ontario Institute of Technology (Ontario Tech University), 2000 Simcoe St. N., Oshawa, ON L1L 0M7, Canada.
2 Department of Mechanical Industrial and Aerospace Engineering, Concordia University, 1455 De Maisonneuve Blvd. W., Montreal, QC H3G 1M8, Canada.

Description:

Adapting to the growing demand for personalized, small-batch manufacturing, this study explores the development of additively manufactured molds for electroforming personalized metal parts. The approach integrates novel multi-level mold design and fabrication techniques, along with the experimental procedures for the electroforming process. This work outlines design considerations and guidelines for effective electroforming in additively manufactured molds, successfully demonstrating the production of composite metal components with multi-level and free-form geometries. By emphasizing cost efficiency and part quality, particularly for limited-thickness metal components, the developed technique offers distinct advantages over existing metal additive manufacturing methods. This approach establishes itself as a flexible and durable method for metal additive manufacturing, expanding the scope of electroforming beyond traditional constraints such as thin-walled hollow structures, 2D components, and nanoscale applications.





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